Explore Mass Transfer and Bonding for Micro LED Innovation

Explore Mass Transfer and Bonding for Micro LED Innovation

This seminar focuses on the mass transfer and bonding technology of sapphire-free Micro LED chips (ranging from 10s of microns to several tens of microns in size) on glass-based LTPS backplanes, with a pitch of dozens to hundreds of microns.

It systematically reviews mainstream technical routes, including chip pickup, alignment, mass transfer, and integration bonding, and compares the advantages, disadvantages, and industrialization maturity of each solution.

Key discussions will cover the adaptability of different technologies to large-scale production, as well as their matching with critical display performance indicators such as resolution, brightness, uniformity, yield, and cost.The aim is to analyze the optimal application scenarios for each technical approach and provide practical references for the scaled deployment of Micro LED displays in various terminal products.